Klüberfluid NH1 1-002

Description

Klüberfluid NH1 1-002 is a versatile organic solvent designed for applications requiring NSF H1 and K1 registration. It offers universal solvent properties and works particularly well when combined with other NSF H1 or 3H-registered products, enhancing production stability and operator safety.

Key features of Klüberfluid NH1 1-002 include:

• Exceptionally high flash point, which is uncommon for organic solvents.
• Stable mixture compatibility with PARALIQ P 68 and PARALIQ P 91, improving lubrication efficiency.

Klüberfluid NH1 1-002 is NSF H1 registered, making it compliant with FDA 21 CFR § 178.3570. It is formulated for incidental food contact and is safe for use in the food-processing, cosmetics, pharmaceutical, and animal feed industries. Additionally, it is NSF K1-registered as a surface cleaner and degreasing agent.

To enhance the reliability of production processes, the use of Klüberfluid NH1 1-002 is recommended, though an additional risk analysis (e.g., HACCP) should be conducted.

Application

Klüberfluid NH1 1-002 is suitable for various industrial applications, particularly those requiring NSF H1 or K1-registered products.

• As a pure solvent, it serves as a residue-free forming fluid that evaporates cleanly.
• As a dispersant, it enhances the spreadability of lubricating films, improving the application of oils and greases (e.g., in aluminum packaging production).
• In manufacturing, it is particularly effective for deep drawing aluminum packages in the food and pharmaceutical industries.
• As a surface cleaner, it quickly and efficiently removes oils, greases, and waxes from metal surfaces.

Application Instructions

• Mixing ratios can be adjusted based on process requirements.
• No specific sequence is required when mixing Klüberfluid NH1 1-002 with PARALIQ P 68 or PARALIQ P 91.
• To reduce contamination risks, clean the surface with Klüberfluid NH1 1-002 before applying the lubricant.
• When applied via spray, an exhaustion device is mandatory to prevent inhalation exposure (see SDS, section 2).